B-plus presents new CPU Module solutions based on the VortexDX86 SoC by DM&P. These modules do not carry a graphics processing unit (GPU) and perfectly fit in headless and low power applications.

Combining the features of x86 architecture, extended temperature and passive cooling, these...

The b-plus team invites you to visit our booth at the embedded world 2010 in hall 9-, the joint stand of Cluster MST. This year we present our brand new CPU module solution for headless applications.

On February 24^th and 25^th 2010 Cluster Mikrosystemtechnik hosts the 2^nd Landsuther Symposium Microsystems electronics. On February 25^th b-plus gives a paper about "Tool based message rerouting on signal level - a specialist development tool for communication structures in cars". Additionally to that we...