Two decades of technology partnership: b-plus and JUMPtec®

Trust and understanding of technology - a special partnership with a regional history.

From DIMM PCs to individual baseboard designs

Around 20 years ago, JUMPtec® began a technological success story with the DIMM-PC 586, a market innovation as an x86 module, which has been successfully continued as a DIMM board at b-plus to this day and integrated into customer projects. At that time, the pin assignment of the DIMM PCs largely corresponded to that of the ISA bus and was characterized by its very small form factor compared to a PC104 board. The DIMM PCs had full PC functionality and were therefore very successful in the industrial sector.

The SODIMM 144 socket PC in credit card format or the e-PDA series are just a few examples of the outstanding cooperation and development expertise of both companies.

Over the years, b-plus has also developed numerous baseboard designs for the integration of Kontron modules - a perfect fit for demanding applications and the basis for many innovative system solutions.

Embedded expertise that connects

One of the central elements of the collaboration are the COM Express® modules, which b-plus has already been using for several product generations in its own BRICK product line. The modules from JUMPtec® thus form a technological cornerstone in the embedded development of the b-plus product and solution portfolio.

At the same time, b-plus is not only a user, but has also been active as a value-added reseller (VAR) for many years: The baseboard and system design for ruggedized applications is another success factor of the partnership. This results in robust systems that are specially developed for mobile applications in outdoor areas and individually adapted to customer requirements.

The close technical interaction is not only evident in the product design, but also in the joint trade fair appearance: visitors to this year's Embedded World 2025 in Nuremberg were able to take a closer look at the integration of the COM Express® module on the current BRICK Main Board.

Use in own portfolio - synergies with JUMPtec® technology

The technology from JUMPtec® ideally complements b-plus' own product portfolio: the long-term integration of the modules - for example in the new BRICK2 x11 or the LOGifyer series - creates synergies that are used in both in-house developments and customer-specific projects. Particularly noteworthy is the close integration in the design-in process, which not only enables efficient development times, but also ensures the highest quality and long-term availability.

Proximity you can feel - regional and technical

The collaboration between b-plus and JUMPtec® is characterized by a deep mutual understanding. Georg Vogl, Product Manager of the BRICK line at b-plus, describes the partnership aptly:

"Thanks to our proximity to JUMPtec® - both regionally and technically - we have a reliable partner who is always on hand to help us with the design-in of our own and customer products." Georg Vogl, Product Manager BRICK product line.

Flexibility and professional support are just some of the advantages that JUMPtec® has to offer. Customers and partners benefit from the various design-in services such as a fixed, personal contact person, technical support, circuit diagram checks and customer-specific adaptations to hardware and software.

A look into the future

This long-standing relationship symbolizes what has become more important than ever in our industry: consistency, trust and innovative strength over decades.

At the ADAS & Autonomous Vehicle Technology Expo in Stuttgart from May 20 - 22, 2025, b-plus presented the latest generation of measurement technology with the new COM Express® module COMe bTL6-H with Xeon® processor for the first time. With the BRICK2 x11 and the new LOGifyer series, b-plus is thus providing its customers with even more powerful components that enable long-term availability and an extended temperature range down to -40°C.

"With JUMPtec® at our side, we are looking forward to the coming years - and to jointly advancing innovative embedded technologies from the embedded mountains in Deggendorf." - b-plus

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